Browse Topic: Semiconductors

Items (312)
Molecular Engineering for Mechanically Resilient and Stretchable Electronic Polymers and Composites19AERP12_1012/1/2019
Establishing the design criteria for elasticity and ductility in conjugated polymers and composites by analysis of the structural determinants of the mechanical properties. Air Force Research Laboratory, Arlington, Virginia The ability to predict the mechanical properties of organic semiconductors is of critical importance for roll-to-roll production and thermomechanical reliability of organic electronic devices. This research describes the use of coarse-grained molecular dynamics simulations to predict the density, tensile modulus, Poisson ratio, and glass transition temperature for poly(3-hexylthiophene) (P3HT) and its blend with C60. In particular, it is shown that the resolution of the coarse-grained model has a strong effect on the predicted properties. It was found that a one-site model, in which each 3-hexylthiophene unit is represented by one coarse-grained bead, predicts significantly inaccurate values of density and tensile modulus. In contrast, a three-site model, with one coarse-grained bead for the thiophene ring and two for the hexyl chain, predicts values that are very close to experimental measurements (density = 0.955 g cm−3, tensile modulus = 1.23 GPa, Poisson ratio = 0.35, and glass transition temperature = 290 K). The model also correctly predicts the strain-induced alignment of chain, as well as the vitrification of P3HT by C60 and the corresponding increase in the tensile modulus (tensile modulus = 1.92 GPa, glass transition temperature = 310 K).
High Performance Motor and Inverter System for a Newly Developed Electric Vehicle2018-01-04614/3/2018
This paper describes a newly developed motor and inverter system with maximum torque of 320 Nm and maximum power of 110 kW for a 2018 model year EV. The system achieves this performance with no increase in size from the previous 2013 model year system with maximum torque of 254 Nm and maximum power of 80 kW. The specific features of the new system described in this paper are summarized below. A new inverter power module that adopts a direct cooling structure produces higher current density than the previous model. The designs of components experiencing structural and electrical variation that affects heat generation by the power semiconductors were confirmed. Furthermore, the motor temperature is estimated for thermal protection. These features allow for control logic that can optimally manage the temperatures of the power semiconductors and the motor to facilitate the high torque performance of the system. The motor voltage management has also been optimized in order to reduce the current level and thereby contributes to the system’s high power performance and high efficiency. The motor also adopts magnets with reduced heavy rare earth elements. This improves heat resistance and obtains resource savings. In addition, one of the novel features of the new EV is e-Pedal that provides not only deceleration but also stopping by operating only the accelerator pedal. This is achieved by motor control logic of the motor and inverter system that generates the optimum motor torque in response to each road grade.
Namiki, KazushigeMurota, KoheiShoji, Mitsuhiro
Energy Consumption of Passenger Compartment Auxiliary Cooling System Based on Peltier Effect2017-01-01553/28/2017
The closed cabin temperature is anticipated to be cooled down when it is a bit hot inside the driving car. The traditional air-condition lowers the cabin temperature by frequently switching the status of the compressor, which increases the engine’s parasitic power and shortens the compressor’s service-life. The semiconductor auxiliary cooling system with the properties of no moving parts, high control precision and quick response has the potential to assist the on-board air-condition in modulating the cabin temperature with relative small ranges. Little temperature differences between the cabin and the outside environment means that the system energy consumption to ensure the occupant comfort is relatively low and the inefficiency could be made up by the renewable energy source. This research focuses on the influence of the vehicle speed and the ambient temperature over the cooling energy consumption considering occupant heat dissipation in order to maximize the system energy utilization. Firstly, the occupant heat dissipation model is established and the system refrigerating capacity is confirmed for occupant comfort. Secondly, the temperature and the heat flux density at both ends of the semiconductor are studied. Finally, the energy consumption regulations of the auxiliary cooling system are clarified for different vehicle speeds and ambient temperatures. The results show that the vehicle speed is a key factor affecting the supplied current, especially for the vehicle speed less than 40km/h. The system current variation is within 0.4A corresponding to the ambient temperature changes. The occupant heat dissipation changes the current range. The system energy utilization could be improved by controlling the supplied current in a relatively small range at various vehicle speeds and ambient temperatures.
Xu, YongbingTan, GangfengGuo, XuexunPing, Xianyao
Power Module Design Verification for xEV Application Under Extreme Conditions2017-01-12463/28/2017
Power modules play a key role in traction inverters for vehicle electrification applications. The harsh automotive operating environment is a big challenge for power modules. The paper highlights the challenges for power modules usage in electrified vehicles (xEVs), and proposes a design verification procedure for such application in order to ensure the reliable operation under all conditions. First, power modules operate in all climate zones and are exposed to a wide ambient temperature range underhood from -40°C to 105°C. A typical automotive power module should therefore withstand a junction temperature from -40°C to up to 175°C without exceeding its safe operating area (SOA), e.g. avalanche breakdown voltage, maximum current, and thermal limit. Second, an inductive induced high voltage spike could be generated during the power semiconductor fast switching at high voltage and high current conditions. The voltage clamping capability is usually required to prevent power semiconductor breakdown under such high voltage spike. Moreover, IGBT short circuit capability is desired to allow adequate time to trigger protection once a short circuit occurs in the motor windings or the inverter. The power module in xEV application is used as an example to show the proposed design verification process including 1) wide temperature range of operation, 2) voltage clamping capability, and 3) short circuit capability.
Xu, FanChen, LihuaYang, ShuitaoZhou, YanAlam, Mohammed Khorshed
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