Magazine Article

Improved Model Predicts Heat Loss in Gallium Nitride Semiconductors

TBMG-36189

03/01/2020

Abstract
Content

Engineers have found that the model currently used to predict heat loss in a common semiconductor material does not apply in all situations. By testing the thermal properties of gallium nitride semiconductors fabricated using four popular methods, they discovered that some techniques produce materials that perform better than others.

Meta TagsDetails
Citation
"Improved Model Predicts Heat Loss in Gallium Nitride Semiconductors," Mobility Engineering, March 1, 2020.
Additional Details
Publisher
Published
Mar 1, 2020
Product Code
TBMG-36189
Content Type
Magazine Article
Language
English