Browse Topic: Microelectromechanical devices (MEMS)

Items (142)
High Resolution LiDAR Based on Single Chip SPAD Array2019-01-01194/2/2019
It is important that Advanced Driver Assistance Systems (ADAS) and Automated Driving Systems (AD) detect on-road objects, road vehicles and pedestrians. The typical detection devices mounted on ADAS and AD include a camera, a millimeter-wave radar and a Light Detection And Ranging (LiDAR). Since LiDAR can obtain accurate distance and fine spatial resolution due to its short wavelength, it is expected that small objects such as a tire can be detected. However, the conventional LiDAR is equipped with multiple light transmitters and light receivers such as avalanche photo diodes. This causes LiDAR system to be expensive and large in size. Aiming to reduce the cost and size of LiDAR, we employed Single-Photon Avalanche Diode (SPAD) which can be fabricated by CMOS process and easily arrayed. We also developed “Single Chip SPAD Array“ in which the two-dimensional array of SPAD and a signal processing block of range calculation were integrated into a single chip. The light-receiving area was composed of 260x12 SPAD-pixels array. In order to verify the principles, we designed a prototype of LiDAR on which a single chip SPAD array, a micro-electro-mechanical systems (MEMS) mirror as a scanner and 100W laser diode were mounted. The field-of-view was 55x9.1 degrees (HxV) and the vertical angular resolution split by SPAD array was 0.76 degrees. Using the prototype, we were able to detect the target of 10% reflectivity at a distance of 50m. Therefore, we succeeded in verifying the principles of sensitivity improvement by SPAD-LiDAR and simulated its behavior. Moreover, based on this result, we optimized SPAD pixels and LiDAR configuration and confirmed that it is possible to detect a piece of broken tire of around 4% reflectivity by the simulation on the assumption of an actual road scene under daylight.
Hata, TakehiroOzaki, NoriyukiMurakami, YoshihiroAzuma, KentaKashiwada, ShinjiYanai, Kenichi
Angular Random Walk Estimation of a Time-Domain Switching Micromachined Gyroscope17AERP04_104/1/2017
Achieving near navigation-grade performance without the need to produce resonators with very high quality factors. Space and Naval Warfare Systems Center Pacific, San Diego, California The primary metrics that prohibit the use of microelectromechanical systems (MEMS) gyroscopes for navigation-grade inertial navigation units (IMUs) are angle random walk (ARW), bias instability, and scale factor instability. The need for MEMS gyroscopes is due to their decreased cost, size, weight, and power (CSWaP) constraints compared to current navigation-grade solutions. Note that to avoid confusion, while in a statistical context a random walk describes a particular type of random process, ARW is used herein to quantify the effects of white, or Gaussian, noise processes on the rate estimate of a gyroscope. The accepted theory about how to mitigate effects associated with thermomechanical noise, and thus lower ARW, quality factors on the order of a million are needed. While resonators with quality factors on the order of a million have been demonstrated in laboratory settings, navigation-grade ARW has only been demonstrated in high-vacuum systems (<10 μTorr) that would be challenging to implement in a portable system. Other means of reducing ARW, such as increasing the amplitude of the drive mode, can be problematic. For electrostatically transduced devices, which is one of the more common methods used with MEMS, large oscillations can introduce nonlinear behavior such as electrostatic softening or pull-in.
MEMS Oscillators with Improved Resilience for Harsh Automotive Environments2016-01-01014/5/2016
Oscillators are key components in automotive electronics systems. For example, a typical automotive camera module may have three or more oscillators, providing the clocks for microcontrollers, Ethernet controllers, and video chipsets. These oscillators have historically been built around a quartz crystal resonator connected to an analog sustaining circuit driving the crystal to vibrate at its resonant frequency. However, quartz-based devices suffer from poor performance and reliability in harsh automotive environments. SiTime has developed timing solutions based on silicon micro-electromechanical systems (MEMS) technology that exhibit better electromagnetic noise rejection and better performance under shock and vibration. In this paper, we first discuss the design and manufacturing of the MEMS-based device, with emphasis on the specific design aspects that improve reliability and resilience in harsh automotive environments. These aspects include the SOI-based MEMS fabrication process, the oscillator and state-of-the-art temperature compensation architecture, and the manufacturing and packaging process. We then describe the test methods used to evaluate the resilience of the device, including electromagnetic susceptibility (EMS), and performance during shock and vibration. The results show that the MEMS-based oscillator performs better than all quartz oscillators that were tested, with up to 50x better EMS, up to 24x better performance during shock, and up to 100x and 20x better performance during sinusoidal and random vibration, respectively.
Arft, CarlLu, Yin-ChenParvereshi, Jehangir
Fabrication of an Integrated Photonic Waveguide Joint in Micromachined SiliconTBMG-242554/1/2016
High-aspect-ratio silicon structures are necessary components in many MEMS (microelectromechanical systems). Aspect ratio is defined as the ratio of the height of the structure to its lateral width. The structures are typically fabricated through bulk micromachining steps such as deep reactive ion etching. In some cases, multiple levels of high-aspect-ratio structures are required. For instance, one may want to etch completely through a silicon wafer to thermally isolate a bolometer or provide waveguide coupling to an antenna defined on an insulating membrane, and at the same time have integrated high-topology structures required for microwave coupling or filtering. Definition of the structures typically uses photolithographic technology. But for high-aspect-ratio structures, spin cast resist becomes difficult to incorporate due to the non-uniform thickness of the resist around tall structures. One can cast very thick layers of photoresist, but this limits the minimum feature size, and additionally, very thick layers of photoresist are difficult to work with due to solvent release and moisture that can cause the resist to crack or swell. For electromagnetic reasons, the structures would preferably be made from conductive material such as metal or degeneratively doped silicon. The objective of this work was to incorporate multiple levels of conductive high-aspectratio structures with standard micromachining processes.
A microelectromechanical system (MEMS) glow discharge plasma electron and ion source (GDEIS) was designed for operation in high-pressure environments such as planetary atmospheres for mass spectroscopy. Glow discharge electron/ ion sources create electrons and ions from gas molecules in an excited plasma. A plasma is generated between two charged plates, and the polarity induced determines the electron or ion signal.
The MAI-400SS Space Sextant is a turnkey Attitude Determination And Control System (ADACS) for CubeSats and nanosatellites. It is an enhanced version of the MAI-400, which is a precision CubeSat ADACS incorporating three reaction wheels, three electromagnets, and an ADACS computer in a ½-U module. This Space Sextant version incorporates two star trackers to improve overall pointing knowledge to 0.02° or better. The star trackers feature “Lost In Space” attitude determination requiring no a priori information.
A MEMS (microelectromechanical systems) micro-translation stage (MTS) with large linear travel capability was developed that uses capacitive electrostatic forces created by stators arranged linearly on both sides of a channel, and matching rotors on a moveable shuttle for precise movement of the shuttle. The device, which is essentially a linear motor built from silicon base with microfabrication techniques, will be able to rapidly translate across large distances using only three-phase power. The moveable shuttle can be as small as 100 mm and can house a variety of elements including lenses and mirrors. The shuttle can be tailored to travel distances as small as 10 mm and as large as 300 mm, with as little as 10 mm between adjacent shuttle stops.
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