Browse Topic: Semiconductor devices

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Integrated Powertrain Domain Controller Using Wide Band Gap Devices For EV Applications2026-26-0055To be published on 01/16/2026
The rapid evolution of electric vehicles (EVs) has amplified the demand for highly integrated, efficient, and intelligent powertrain architectures. In the current automotive landscape, EV powertrain systems are often composed of discrete ECUs such as the OBC, MCU, DC-DC Converter, PDU, and VCU, each operating in isolation. This fragmented approach adds wiring harness complexity, control latency, system inefficiency, and inflates costs making it harder for OEMs to scale operations, lower expenses, and accelerate time-to-market. This paper addresses the core issue of fragmented control architectures in EV powertrains by proposing an integrated domain controller-based solution for EV powertrain. The technical gap lies in the absence of a centralized intelligence capable of seamlessly managing and synchronizing the five key powertrain aggregates: OBC, MCU, DC-DC, PDU, and VCU under a unified software and hardware platform. This fragmentation leads to redundancy in computation, increased
Kumar, Mayank, Deosarkar, Pankaj, Inamdar, Sumer, Tayade, Nikhil
Study of Critical Vias Design Parameters for Power Electronics Thermal Management2024-26-031701/16/2024
With the advent of wide band gap semiconductor devices like SiC based MOSFETs/Diodes, there is a growing demand for utilizing electrical power instead of the conventional fuel-based power generation in both automotive and aerospace industry. In automotive/aerospace industry the focus on electrification has resulted in a need for sub-systems like inverters, power distribution units, motor controllers, DC-DC converters that actively utilize SiC based power electronics devices. To address the growing power density requirements for electronics in next generation product families, more efficient & reliable thermal management solution plays a critical role. The effective thermal management of the power electronics is also critical aspect to ensure overall system reliability. The conventional thermal management system (TMS) optimization targets heat sink/ cold plate design parameters like fin spacing, thickness, height etc. or sizing of the required cooling pump/fan. This paper focuses on
Bhardwaj, Divyanshu, Patil, Sachin, Datta, Sauradeep, Pawar, Sunny, Dougherty, Derek
How 3D printing could add efficiency to EV power electronics21AUTP05_0805/01/2021
“Think production!” Perhaps that advice should be posted on the wall of every design office, R&D lab and advanced technology center in the auto industry. Although obeying that warning is clearly not cost-effective in some instances, others are ostensibly perfect to take their place in volume manufacture. An example is 3D printing (aka additive manufacturing, or AM), but despite a broadening scope that now embraces rapid prototyping and tooling by entire houses, it could do better in series production of auto components, particularly in the new world of EVs. Prof. Peter Wilson of the U.K.'s newly established Institute for Advanced Automotive Propulsion Systems (IAAPS) at the University of Bath, noted the growing adoption of high-speed SiC (silicon carbide) and other wide-band-gap semiconductor devices demonstrates the benefits that 3D printing could have in the production of EV inverters. “SiC devices offer so much opportunity to improve inverter performance,” Wilson said. “But system
Birch, Stuart
Easier Printing of Circuitry on Wearable FabricsTBMG-3832701/01/2021
Electronic shirts that keep the wearer comfortably warm or cool, as well as medical fabrics that deliver drugs, monitor the condition of a wound, and perform other tasks, may one day be manufactured more efficiently thanks to a key advance in ink.
A Practical Guide to Semiconductor and System Design Capabilities for the Healthcare IndustryTBMG-3814712/01/2020
Analog and mixed signal semiconductors translate real-world signals like temperature, acceleration, pressure, sound, light, bioimpedance, biopotential, flow, touch, and many others into digital information that can be processed and output using a variety of embedded digital and software technologies. This article provides insight into what drives the R&D semiconductor industry for medical devices so healthcare device designers can be better informed about the open market semiconductor product options. It also highlights a sampling of semiconductor products and capabilities on the market today ideally suited for healthcare devices. Finally, it describes how a turnkey electronic design services company can help turn ideas or design needs into a finished, medically certified solution.
Replacing Multiple RF Receivers with Just One Using ChannelizationTBMG-3824312/01/2020
From the early days of analog radio receivers to the superheterodyne channelized receivers of today, many things have changed. Today, different technologies are in use and their capabilities have grown immensely. This article will give you a brief overview of the development of radio receivers. Furthermore, it will show how channelization has made it possible to use one radio receiver to listen to many different radio stations simultaneously.
Replacing Multiple RF Receivers with Just One Using Channelization20AERP12_0512/01/2020
From the early days of analog radio receivers to the super-heterodyne channelized receivers of today, many things have changed. Today, different technologies are in use and their capabilities have grown immensely. This article will give you a brief overview of the development of radio receivers. Furthermore, it will show how channelization has made it possible to use one radio receiver to listen to many different radio stations simultaneously.
Material Advances for LED Quantum Dot EfficiencyTBMG-3801311/01/2020
Developing efficient and cost-effective ultraviolet light-emitting diodes (LEDs), especially in the deepultraviolet (UV-C) is a long-standing goal of the photonics community. UV-C LEDs are of particular interest and could replace gas discharge lamps, revolutionizing disinfection systems, provide water purification, and facilitate non-line-of-sight communication. In light of the on-going global pandemic due to COVID-19, implementation of a rapid surface disinfection method in which chemical cleaning is impractical or not as effective is of critical importance.
Signal-to-Noise Ratio (SNR) in Hyperspectral ImagersTBMG-3767409/01/2020
The Signal-to-Noise Ratio (SNR) is a well-known and readily understood metric for data quality. Stated simply, SNR is the magnitude of the signal divided by the magnitude of the noise in the signal. The SNR can be determined by taking multiple identical measurements, and then dividing the mean value of these measurements, by the standard deviation, σ(λ):
Multiple Sensors Aid in Development of an Electrical Vertical Takeoff and Landing AircraftTBMG-3615703/01/2020
Beta Technologies (South Burlington, VT) has built a prototype Electrical Vertical Takeoff and Landing aircraft (eVTOL) and is putting it through the wringer. They are using wireless sensor systems from Parker LORD, MicroStrain® Sensing Systems (Williston, VT) to monitor the structures and functions of the prototype, both on a test stand and in flight.
For Power-Efficient Wireless Sensing, Start with Analog ProcessingTBMG-3615003/01/2020
It seems like new applications for wireless sensors are appearing nearly every day. Two of the biggest growth areas are wake-word-driven systems like Alexa or Google and remote vibration monitoring of industrial machinery. Vibration monitoring provides useful information about the machinery, either in real time — condition monitoring; or to predict defects 60 or 90 days in advance — predictive maintenance.
Double-Sided Si(Ge)/Sapphire/III-Nitride Hybrid StructuresTBMG-3488808/01/2019
NASA Langley Research Center has developed a double-sided Si(Ge)/ Sapphire/III-Nitride hybrid structure. This technology uses both sides of a sapphire wafer to build device structures — on one side, making either Si or SiGe devices and on the other side, making III-Nitride device structures (e.g. GaN, InGaN, AlGaN).
Visualizing Motion of Water Molecules for Liquid-Based ElectronicsTBMG-3489208/01/2019
A high-resolution inelastic x-ray scattering technique was used to measure the strong bond involving a hydrogen atom sandwiched between two oxygen atoms. This hydrogen bond is a quantum-mechanical phenomenon responsible for various properties of water, including viscosity, that determine a liquid's resistance to flow or to change shape.
Graphene-Silicon Devices for Optoelectronics ApplicationsTBMG-3462806/01/2019
Silicon is a naturally occurring material commonly used as a semiconductor in electronic devices; however, researchers have exhausted the potential of devices with semiconductors made of silicon only. These devices are limited by silicon’s carrier mobility — the speed at which a charge moves through the material — and indirect bandgap, which limits its ability to release and absorb light.
Standardized Symbols for Electrical Circuit DiagramsJ2221_201905 (Current)05/16/2019
This SAE Recommended Practice identifies graphic symbols used in electrical circuit diagrams. The symbols aid troubleshooting electrical systems.
Truck and Bus Electrical Systems Committee
High Performance Processor Architecture for Automotive Large Scaled Integrated Systems within the European Processor Initiative Research Project2019-01-011804/02/2019
Autonomous driving systems and connected mobility are the next big developments for the car manufacturers and their suppliers during the next decade. To achieve the high computing power needs and fulfill new upcoming requirements due to functional safety and security, heterogeneous processor architectures with a mixture of different core architectures and hardware accelerators are necessary. To tackle this new type of hardware complexity and nevertheless stay within monetary constraints, high performance computers, inspired by state of the art data center hardware, could be adapted in order to fulfill automotive quality requirements. The European Processor Initiative (EPI) research project tries to come along with that challenge for next generation semiconductors. To be as close as possible to series development needs for the next upcoming car generations, we present a hybrid semiconductor system-on-chip architecture for automotive. This microprocessor is inspired and derived from HPC
Reinhardt, Dominik, Dannebaum, Udo, Scheffer, Michael, Traub, Matthias
Development of Electric Oil Pump Controller in Hybrid Vehicle Based on PMSM (Permanent Magnet Synchronous Motor) and the AUTOSAR Platform2019-01-076504/02/2019
Traditional hybrid vehicles operated two types of oil pump, mechanical for combustion engine and electrical for electric motor, to supply oil pressure for automatic transmission in each power source. New hybrid vehicles has only one electrical pump to reduce system volume and to improve fuel efficiency. Purposes of this study are to make standardization of firmware development process for oil pump unit (OPU) and electric oil pump (EOP) and to apply permanent magnet synchronous motor (PMSM) instead of brushless DC (BLDC) motor. In old-fashioned non-operating system (OS) firmware, it was convenient to calculate control timing for motor control, however the firmware was deeply dependent to specific microcontroller Unit (MCU). In other words, much of efforts and time are needed if new MCU were applied. In this study, new standard development process for MCU firmware can be built up based on automotive open system architecture (AUTOSAR) platform by developing specific motor complex device
Kim, Haejin, Ryu, Seung-yun, Yoo, Hojeong, Kim, Hyoungsu, Kim, Gyeongcheol
Modular Biosensor Patch19AERP04_0804/01/2019
Identifying new biomarkers to help monitor cognition and stress in the human body could enhance human performance. Army Medical Research Acquisition Activity, Fort Detrick, Maryland Researchers are identifying new biomarkers to help monitor cognition and stress in the human body and enhance human performance. Traditional biomarkers like heart rate, temperature, oxygen partial pressure, blood glucose, electrolyte concentration, and others have been correlated with cognition and stress states. However, the correlation is indirect. Molecular biomarkers with stronger and more specific links are preferred. Molecular biomarkers can be more specific to cognition states and typically take the form of bioactive molecules including steroids, proteins, carbohydrates, lipids, and nucleic acids. The tools available to quantify molecular biomarkers during their discovery are sensitive and selective, but also have significant drawbacks. In particular, these tools are inconvenient in a variety of ways
Modular Biosensor PatchTBMG-3413704/01/2019
Researchers are identifying new biomarkers to help monitor cognition and stress in the human body and enhance human performance. Traditional biomarkers like heart rate, temperature, oxygen partial pressure, blood glucose, electrolyte concentration, and others have been correlated with cognition and stress states. However, the correlation is indirect. Molecular biomarkers with stronger and more specific links are preferred.
Building Blocks for a Practical Wireless Sensor SystemTBMG-3388403/01/2019
We recently interviewed Justin Bessette, Manager, Wireless Systems and Software Engineering at LORD Corporation, Micro-Strain® Sensing Systems, about the nuts and bolts of a wireless sensor system.
Using RISC-V to Simplify Data Logging in Space19AERP02_0602/01/2019
Worldwide demand for low Earth orbit satellites is increasing at an unprecedented pace, driven by diverse needs such as faster and more affordable Internet access, and faster revisit rates with finer resolution for imaging data. The satellite payload instruments performing communications or imaging functions are becoming increasingly sophisticated and capable and require the collection of increasing amounts of telemetry data to ensure the safe and reliable operation of the satellite. This is accomplished using multiple large, power-hungry, and heat-generating circuit cards that contain a variety of discrete components for monitoring payload health. The component count of these I/O cards and the area and power they consume can all be significantly reduced by leveraging the latest advances in radiation-hardened mixed-signal integrated circuits (ICs) combined with a new open instruction set architecture (ISA) for reduced instruction set computing called RISC-V.
Novel Characterization Methods for Anisotropic and Mixed-Conduction MaterialsTBMG-3377102/01/2019
State-of-the-art electronic and optoelectronic devices require electronic materials with specialized properties that cannot be characterized with standard methods, or that must be characterized with extra precision. As a result of this research, the following new materials characterization methods have been developed:
High Speed Raw Radar Data Acquisition using MIPI CSI2 Interface for Deep Learning in Autonomous Driving Applications2019-26-002001/09/2019
Technological Advances in ADAS (Advanced Driver Assistance Systems), AI (Artificial Intelligence) and AD (Autonomous Driving) there has been a demand of raw data transfer from Sensors like Radar, Camera, LiDAR, etc. because existing methods are unable to meet sensor fusion requirements of Level 5 AD. Advanced deep learning algorithms need raw data to extract complex features and fusion of data from sensors further helps to build algorithms that simulate human-like intelligence. Traditionally, the output of Radar is point cloud data [i.e. Range, Velocity, Angle] of the detected target which is the outcome of the computation done by the local radar. Transfer of raw data allows the central computer to decide whether to process the radar data at the edge or at the central computer where sensor fusion can be performed. This leads to the high data rate transfer requirements from the Radar sensor. MIPI being an established standard for high data rate transfer from camera, car OEMs extended
Doshi, Nirav, Balasubramanian, Aanandh, Katuri, Srinivasa Rao
Transient Stability Analysis of DC Solid State Power Controller (SSPC) for More Electric Aircraft2018-01-192710/30/2018
The solid state power controller (SSPC) is one of the most important power electronic components of the aircraft electrical power distribution (EPS) systems. This paper presents an architecture of the DC SSPC and provides the mitigation techniques for transient voltage overshoot during its turn-off. The high source side inductance carries breaking current (9xnominal current) just before turnoff and induces large voltage transient across the semiconductor devices. Therefore, the stored inductive energy needs to be dissipated in order to prevent semiconductor switches from over-voltage/thermal breakdown. Three different transient voltage suppression (TVS) devices to reduce voltage stress across switches are included in the paper for detail study. The comprehensive comparison of the TVS devices is presented. In addition, the thermal impact of the TVS devices on the semiconductor switches is also analyzed. Later, the transient simulation model of the SSPC is built in LT-Spice and the
Adhikari, Jeevan, Yang, Tao, Rashed, Mohamed, Bozhko, Serhiy, Zhang, JiaWei, Wheeler, Patrick W.
“Soft Hardware” Cloth Has Built-In Electronic DevicesTBMG-3311310/01/2018
Optical fibers have been traditionally produced by making a cylindrical object called a preform — essentially, a scaled-up model of the fiber — and then heating it. Softened material is then drawn or pulled downward under tension and the resulting fiber is collected on a spool.
Soft Contacts Monitor Glucose, Deliver MedicationTBMG-3246008/01/2018
Researchers have developed soft contact lenses that not only correct vision but also can monitor glucose and medical conditions and be used for ocular pain relief or drug delivery. The team created a novel method for attaching sensors and other small devices to soft contact lenses.
Auxiliary Power Solutions for 1500 VDC Photovoltaic SystemsTBMG-3250608/01/2018
Photovoltaic systems are continually evolving to improve their efficiency and financial viability. One trend is to move to larger strings of cells giving higher dc voltages to be converted to ac voltage for the grid. Cost savings result, but auxiliary power supplies for monitoring and control need to accept these higher voltages as inputs.
Nuclear Radiation-Detecting DeviceTBMG-2970307/01/2018
A material was developed for nuclear radiation detection that could provide a significantly less expensive alternative to the detectors now in commercial use. Specifically, the high-performance material is used in a device that can detect gamma rays — weak signals given off by nuclear materials — and easily identify individual radioactive isotopes. The device could be used in applications in homeland security such as detecting dirty bombs and the proliferation of nuclear materials.
Development of Mass Producible ANC System for Broad-Band Road Noise2018-01-156106/13/2018
The mass producible broad-band ANC system for road noise is developed with fully digital control system. For this configuration, installation packages are intensively considered by minimizing size of the controller, simplifying wiring system and implementing virtual microphone techniques. Virtual microphone technique enables error microphone to be installed in remote position of driver’s ear, and therefore, increases installation degree of freedom significantly. To enhance noise control performance with the minimum latency, filter design of FxLMS algorithm is optimized while additional audio compensation techniques are applied to maintain audio performance of amplifier. The present ANC system is equipped to HMC (Hyundai Motor Company) new release of hydrogen driven vehicle, which is introduced in the technology promotion event in Pyeongchang Olympic 2018.
Oh, ChiSung, Ih, Kang-Duck, Lee, Jinmo
Fabrication Process Produces Nanostructures for Electronic DevicesTBMG-2903106/01/2018
Demands for improved computer processing power have led researchers to explore both new processes and other materials beyond silicon to produce electronic components. Semiconductor devices are created on wafers through a multi-step process to coat, remove, or pattern conductive materials. Traditional processes are wet etch, in which a sample with blocked aspects is immersed in an acid bath to remove substances, and reactive ion etching, in which ions bombard exposed surfaces on the wafer to change its chemical properties and remove materials in those exposed regions. Both have been used to develop the intricate electronic patterns on circuits, and use silicon as a foundation for this type of patterning.
New Technologies Tackle UAV ChallengesTBMG-2890105/01/2018
Unmanned vehicles for air, land, and water represent an increasingly-important capability for virtually all military services worldwide. Because each new generation of device technology promises capabilities and higher levels of overall performance for unmanned vehicles of all types, military customers expect these benefits in the latest UAV offerings. To meet these expectations, systems engineers must deal with increasingly difficult problems of thermal management, power budgeting, EMI emissions and susceptibility, weight, size, cabling, connectors, antenna management, and command/control functions. Several new technologies and innovative packaging concepts now provide better solutions to these issues.
Silicon Carbide High-Voltage SwitchTBMG-2818001/01/2018
High-voltage wide bandgap (WBG) semiconductor devices like 15-kV silicon carbide (SiC) MOSFETs have attracted attention because of potential applications in high-voltage and high-frequency power converters. These devices, however, are not commercially available, and their high cost due to expensive material growth and fabrication may limit their widespread adoption in the future.
Integrated Three-Dimensional Module Heat Exchanger for Power Electronics CoolingTBMG-2780311/01/2017
Critical elements in the operation of electric drive systems are power electronics and power semiconductor packages. Improving thermal management of power electronics can help reduce the cost, weight, and volume of electric drive systems, and thus increase market acceptance. The power semiconductor packaging must provide the necessary electrical connections, while at the same time enabling heat removal from the semiconductor devices such as insulated gate bipolar transistors (IGBTs) and diodes.
GaN Breaks Barriers17AERP10_0510/01/2017
RF Power Amplifiers Go Wide and High The increasing demand for higher data rates in telecommunications and higher resolution in industrial systems is pushing the frequency of operation higher for the electronics that support them. Many of these systems operate over a wide frequency spectrum, and further increased bandwidth requirements are a common request for new designs. Across many of these systems there is a push to use one signal chain for all frequency bands. Advancements in semiconductor technology have led to breakthroughs in capability for high-power and wideband amplifiers. An area that was once dominated by traveling wave tubes has begun to cede ground to semiconductor devices, thanks to the gallium nitride (GaN) revolution that is sweeping the industry and enabling MMICs that generate >1 W of power over many decades of bandwidth. As shorter-gate-length gallium arsenide (GaAs) and GaN transistors become available - coupled with improved circuit design techniques - new
GaN Breaks BarriersTBMG-2766210/01/2017
The increasing demand for higher data rates in telecommunications and higher resolution in industrial systems is pushing the frequency of operation higher for the electronics that support them. Many of these systems operate over a wide frequency spectrum, and further increased bandwidth requirements are a common request for new designs. Across many of these systems there is a push to use one signal chain for all frequency bands.
A Novel Hybrid SiC-GaN Based Full-Bridge DC-DC Buck Converter with Improved Efficiency2017-01-203109/19/2017
In aerospace applications, it is important to have efficient, small, affordable, and reliable power conversion units with high power density to supply a wide range of loads. Use of wide-band gap devices, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, in power electronic converters is expected to reduce the device losses and needs for extensive thermal management systems in power converters, as well as facilitate high-frequency operation, thereby reducing the passive component sizes and increasing the power density. A novel hybrid SiC-GaN based full-bridge dc-dc buck converter with improved efficiency for high power applications will be presented in this paper. With the current device manufacturing technology, GaN devices can only handle breakdown voltages up to 650 V, while SiC devices can handle up to 1200 V. GaN devices exhibit remarkable switching performance compared to SiC devices. This work aims to exploit both the high voltage capability of SiC devices and
Kondrath, Nisha, Saini, Dalvir, Smith, Nathaniel
‘Near-Zero-Power’ Temperature Sensor Could Make Wearables Less Power-HungryTBMG-2748109/01/2017
Electrical engineers at the University of California San Diego have developed a temperature sensor that runs on only 113 picowatts of power — 628 times lower power than the state of the art and about 10 billion times smaller than a watt. This “near-zero-power” temperature sensor could extend the battery life of wearable or implantable devices that monitor body temperature, Internet of Things devices, and more.
Modeling the Sound Pressure Loss of an Electromechanical Active Helmholtz Resonator2017-01-182706/05/2017
A muffler attached to an engine attenuates sound over a dedicated frequency range. This research involves the development of an active muffler that is keyed to the revolutions per minute (rpm) of the engine and suppresses the fundamental frequency being exhausted through the tailpipe. The active muffler consists of a tracking side-branch resonator terminated with a composite piezoelectric transducer. The use of an exponential horn as a resonating cavity and terminated with a composite piezoelectric transducer is presented. This would create Electromechanical Active Helmholtz Resonator (EMAHR) creates a notch that can be moved between 200-1000 Hz. The use of acoustical-to-mechanical, mechanical-to-electrical, and analog-to-digital transformations to develop a system model for the active muffler are presented. These transforms will be presented as two-port network parameters. The use of two-port networks to model the electroacoustic system are a defining factor in the analysis. The two
Santora, Michael J., Ige, Cyril Gbenga, Otto, Jeff, Egolf, David
Functional Safety for Battery Monitoring Integrated Circuits2017-01-120203/28/2017
The Battery Monitoring Integrated Circuit (BMIC) is a key technology for Battery Electronics in the electrification of vehicles. Generally speaking, every production hybrid, plug-in hybrid, and battery electric vehicle uses some type of BMIC to monitor the voltage of each lithium battery cell. In order to achieve Functional Safety for the traction battery packs for these electrified vehicles, most designs require higher ASIL ratings for the BMIC such as C or D. For the entire market of available BMIC’s, there is a generic feature set that can be found on almost every IC on the market, such as a front end multiplexer, one or more precision references, one or more Analog to Digital (A/D) converters, a power supply, communications circuits, and window comparators. There is also a fairly consistent suite of self-diagnostics, available on just about every available BMIC, to detect failures and enable achievement of the appropriate ASIL rating. This paper provides a generic approach for the
Tabatowski-Bush, Ben
ECU Structure Strategy to Detect Lift Timing of GDI Solenoid Injectors with High Precision2017-01-162803/28/2017
In gasoline direct injection (GDI) systems, various injection types are needed to reduce emissions and improve fuel consumption. This requires high-precision injection in the region in which the amount of injection is small. Achieving injection of a small amount of fuel using GDI solenoid injectors requires the use of the half-lift region. In this region, however, the variation in the injection amount tends to increase due to the variation in the lift behavior of the injectors, posing the problem of how to achieve high-precision injection. To reduce the variation, we analyzed the lift timing out of the injector current and voltage signal with the ECU in an attempt to adjust the amount of injection. To detect the injector needle-opening timing, we focused on the characteristic point of the injector current signal appearing when the injector needle opens, and to detect the injector needle-closing timing, we focused on the characteristic point of the injector voltage signal appearing when
Ito, Atsushi, Kawano, Masahiro, Fujita, Shohei
Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module *CSP Meta QA Testing*2017-01-001103/28/2017
Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical. Hence different numerical models are studied for the solder
Sridharan, Kesav Kumar, Viswanathan, Swaminathan
A Smart Gate Driver with Active Switching Speed Control for Traction Inverters2017-01-124303/28/2017
The IGBTs are dominantly used in traction inverters for automotive applications. Because the Si-based device technology is being pushed to its theoretical performance limit in such applications during recent years, the gate driver design is playing a more prominent role to further improve the traction inverter loss performance. The conventional gate driver design in traction inverter application needs to consider worst case scenarios which adversely limit the semiconductor devices' switching speed in its most frequent operation regions. Specifically, when selecting the gate resistors, the IGBT peak surge voltage induced by fast di/dt and stray inductance must be limited below the device rated voltage rating under any conditions. The worst cases considered include both highest dc bus voltage and maximum load current. However, the traction inverter operates mainly in low current regions and at bus voltage much lower than the worst case voltage. This paper proposes a low-cost and simple
Zhou, Yan, Chen, Lihua, Yang, Shuitao, Xu, Fan, Alam, Mohammed Khorshed
A Sensorless Control Solution for DCT Oil Pump with BLDC Motor2017-01-163103/28/2017
Double Clutch Transmission system becomes more and more popular in vehicles because of the fuel saving performance, cost efficiency and comfortable feeling during gear change. To save fuel consumption and reduce CO2 emissions, pump can be driven by an electric motor for oil pressure on demand. This paper will introduce a technical solution for sensorless control of an electric pump motor used in a DCT system. Oil pressure control is fulfilled by a speed controller of the oil pump motor. Some critical control requirements for the pump motor are short and reliable start-up stage, stable and accurate speed control. This paper will elaborate on the difficulties of oil pump sensorless control, and how to solve these difficulties with minimum electronic hardware. Test results will be presented. In conclusion, the proposed sensorless control strategy can meet application requirements and meanwhile provide a cost-effective and motor parameters-independent control solution.
Qian, Weizhe, Zhang, Henry
Development of High Quality 4H-SiC Thick Epitaxy for Reliable High Power Electronics Using Halogenated Precursors17AERP02_0602/01/2017
New approaches to synthesizing SiC epitaxial layers could improve electronics performance. Office of Naval Research, Arlington, Virginia Development of robust semiconductor devices with high energy efficiency and reliability is a key objective towards ‘Energy Conversion and Power Management’ for naval system applications. The goal of this research is to create the fundamental knowledge needed for the development of novel approaches to synthesize high-quality, thick SiC epitaxial layers (> 100μm) for reliable high voltage (≥10kV) / high power (>100 kW) electronics for navy ship applications. This program focuses on (a) developing innovative solutions to the current main limitation in SiC homoepitaxy - reduction/elimination of device-killing defects; (b) gaining understanding of the chemical vapor deposition processes in SiC epitaxy, specifically related to precursor gas decomposition dynamics and subsequent parasitic deposition of Si, C and SiC on the gas injector tube walls; and (c
Development of High Quality 4H-SiC Thick Epitaxy for Reliable High Power Electronics Using Halogenated PrecursorsTBMG-2638602/01/2017
Development of robust semiconductor devices with high energy efficiency and reliability is a key objective towards 'Energy Conversion and Power Management ' for naval system applications. The goal of this research is to create the fundamental knowledge needed for the development of novel approaches to synthesize high-quality, thick SiC epitaxial layers (> 100μm) for reliable high voltage (≥10kV) / high power (>100 kW) electronics for navy ship applications.
Transient Thermal Model Evaluation for Semiconductor Devices in Automotive Applications2017-26-035001/10/2017
Automotive Electronic Control Unit (ECU) has semiconductor devices performing various time dependent functions. It is essential to understand the transient thermal behavior of these devices for designing a reliable system. Detailed thermal model (DTM) is the need of the hour to understand the characteristics by performing a transient system level simulation. The information to build DTM is not readily available in the public domain due to intellectual property protection from the device suppliers. To overcome this, the present work showcases the procedure to develop Transient Thermal Network Model (TTNM) using resistance and capacitance values extracted from the impedance curve provided by the semiconductor manufacturer. TTNM model is developed for a typical DPAK and D2PAK device and validated by comparing impedance curve derived from simulation with datasheet. Thermal characterization studies are also carried out to compare the behavior of the traditional lumped model and TTNM to that
Viswanathan, Swaminathan, Sridharan, Kesav Kumar
Glass Fibers with Potential Far Beyond Transmitting LightTBMG-2622501/01/2017
Glass fibers do everything from connecting us to the Internet to enabling keyhole surgery by delivering light through an endoscope. But as versatile as today’s fiber optics are, scientists around the world have been working to expand their capabilities by adding semiconductor core materials to the glass fibers.
Addendum of Self-Aligned Ion Implant to Design and Processing of SiC High-Temperature Transistors for Durable Operation Above 400 °CTBMG-2550610/01/2016
Researchers at NASA’s Glenn Research Center have developed a revolutionary new generation of silicon carbide (SiC) integrated circuit (IC) chips, setting an unprecedented benchmark in the field of high-temperature electronics. In the past, SiC ICs could not withstand more than a few hours of 500 °C temperatures before degrading or failing. Now, Glenn has successfully fabricated prototype chips that can exceed 10,000 hours of continuous operation at 500 °C. The advanced performance stems in part from the development of Glenn’s patented iridium interfacial stack (IrIS), a bondable metallization stack that prevents diffusion of oxygen and gold into silicon carbide (SiC) integrated circuits operating above 500 °C. The enhanced reliability of these components (and the transistors and logic boards they support) will enable important improvements in the control and operation of combustion engines, well-drilling, and other harsh environment systems, thereby greatly impacting operational
An Investigation into the Tradespace of Advanced Wide-Band Gap Semiconductor Devices in a Full-Bridge DC-DC Converter2016-01-199009/20/2016
In aerospace applications, it is important to have efficient, small, affordable, and reliable power conversion units with high power density to supply a wide range of loads. Use of wide-band gap devices, such as Silicon Carbide (SiC) and Gallium Nitride (GaN) devices, in power electronic converters is expected to reduce the device losses and need for extensive thermal management systems in power converters, as well as facilitate high-frequency operation, thereby reducing the passive component sizes and increasing the power density. A performance comparison of state-of-the art power devices in a 10 kW full-bridge dc-dc buck converter operating in continuous conduction mode (CCM) and at switching frequencies above 100 kHz will be presented in this manuscript. Power devices under consideration are silicon (Si) IGBT with Si antiparallel diodes, Si IGBT with SiC antiparallel diodes, Si MOSFETs, SiC MOSFETs, and enhancement-mode GaN transistors. A 10 kW full-bridge dc-dc converter operating
Kondrath, Nisha, Smith, Nathaniel
Optimized Design Procedure for Active Power Converters in Aircraft Electrical Power Systems2016-01-198909/20/2016
In modern aircraft power systems, active power converters are promising replacements for transformer rectifier units concerning efficiency and weight. To assess the benefits of active power converters, converter design and optimization should be carefully done under the operation requirements of aircraft applications: electromagnetic interference (EMI) standards, power quality standards, etc. Moreover, certain applications may have strict limits on other converter specifications: weight, size, converter loss, etc. This paper presents the methodology for performance optimization of different active power converters (active front-ends, isolated DC/DC converters and three-phase isolated converters) for aircraft applications. Key methods for power converter component (e.g. inductors, semiconductor devices, etc.) performance optimization and loss calculation are introduced along with the converter optimization procedure. Targeting at achieving extreme converter efficiency, a 3 kW
Wang, Qiong, Burgos, Rolando, Zhang, Xuning, Boroyevich, Dushan, White, Adam, Kheraluwala, Mustansir
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