Browse Topic: Soldering

Items (84)

A Comparison of Wire Bonding vs. Spot Welding vs. Soldering in the Prevention of Thermal Runaway in a Battery Pack

2024-26-010901/16/2024

EVs are a fast-growing market and appear as a promising option against the high emission of gasoline and diesel vehicles. The growth in the EV market has been decent and a regular buyer is still skeptical due to fire incidents occurring with EVs. Complex electronics, improper thermal management, mechanical abuse, improper cell grading activities and control in production, lack of testing in a production plant, and of course, uneven degradation of cells can be one of the reasons this promising technology is facing thermal runaway and in turn, the wrath of the government and public alike. One of the reasons thermal runaway can be triggered after a cell catches fire is because a part of heat travels via busbars to the neighboring cells, as the busbars can conduct heat faster than the air. For the heat that is conducted, it is easily understandable that we need to break the electrical, as well as thermal conduction connection to the neighboring cells. This paper presents a comparison of

Pawar, Aniruddha, Khan, Faiz, Shah, Harsh, Malani, Shekhar

LEAD-FREE SOLDER VALIDATION TEST PLAN

USCAR40-2 (Current)

11/19/2020

This guideline is applicable to existing lead solder production products that will change to lead-free solder processes to meet the ELV Directive 2000/53/EC Annex II, exemption 8B requirements. This guideline is applicable to similar products used by multiple OEM's that have the same manufacturing processes / equipment. The intent is to streamline the supplier’s environmental testing via common qualification to reduce timing, quantities, and costs.

USCAR

Solders

J473_201808 (Current)08/24/2018

The choice of the type and grade of solder for any specific purpose will depend on the materials to be joined and the method of applying. Those with higher amounts of tin usually wet and bond more readily and have a narrower semi-molten range than lower amounts of tin. For strictly economic reasons, it is recommended that the grade of solder metal be selected that contains least amount of tin required to give suitable flowing and adhesive qualities for application. All the lead-tin solders, with or without antimony, are usually suitable for joining steel and copper base alloys. For galvanized steel or zinc, only Class A solders should be used. Class B solders, containing antimony usually as a substitute for some of the tin or to increase strength and hardness of the filler metal, form intermetallic antimony-zinc compounds, causing the joint to become embrittled. Lead-tin solders are not recommended for joining aluminum, magnesium, or stainless steel. Permissible impurity levels are

Metals Technical Committee

Welding, Brazing, and Soldering - Materials and Practices

J1147_201801 (Current)

01/09/2018

The Joint AWS/SAE Committee on Automotive Welding was organized on January 16, 1974, for the primary purpose of facilitating the development and publication of various documents related to the selection, specification, testing, and use of welding materials and practices, particularly for the automotive and related industries. A secondary purpose is the dissemination of technical information.

Metals Technical Committee

Impact Mechanism of Multiple Major Welding Parameters on Mechanical Properties of Laser Brazing Lap Joint of Galvanized Steel for Vehicle

2017-01-501009/22/2017

In order to research the effect of process parameters (laser power, welding speed, wire-feed speed, spot diameter) on mechanical properties of Zn-coated Steel Laser Brazing Lap Joint for vehicle, the influence of welding parameters on energy input of brazing seam cross section was theoretically analyzed, and then a great number of laser brazing experiments of 0.7mm galvanized steel was carried out. After that, the tensile strength and micro-hardness tests were also done for well-formed joints of galvanized steel formed in the laser brazing. The results show that joints with good mechanical properties and surface morphology can be formed when laser power is in the range of 2500-3200W and the other parameters keep in a specified range. Joint performance significantly reduces when the value of wire-feed speed exceeds 3.0m/min for that a wider brazing seam cross section can’t be formed. And tensile strength of the joint drops steeply when welding speed exceeds 50mm/s, because the solid

Liu, H.J., Zhang, X.D.

CONNECTORS, PLUG, ELECTRIC, SOLDER CONTACT, 90°, AN TYPE

AS31081B (Current)06/09/2017

AE-8C1 Connectors Committee

Development of a New MOS Rectifier for High-Efficiency Alternators

2017-01-124003/28/2017

For the purpose of improving vehicle fuel efficiency, it is necessary to reduce energy loss in the alternator. We have lowered the resistance of the rectifying device and connecting components, and control the rectifying device with an IC to reduce rectification loss. For the package design, we have changed the structure of the part on which the rectifying device is mounted into a high heat dissipation type. The new structure has enabled optimizing the size of the rectifying device, resulting in the reduction of size of the package. In addition, the rectifying device is mounted using a new soldering material and a new process, which has improved the reliability of the connection. Moreover, since the alternator has introduced a new system, the controller IC has a function for preventing malfunction of the rectifying device and a function for detecting abnormalities, in order to ensure safety. These technologies have realized a low-energy loss high-reliability rectifier, which contribute

Matsushita, Koki

Hermetic Feedthroughs for Mission-Critical Electronics

TBMG-2384802/01/2016

One of the most common causes of electronics failure is moisture. Because water and electronics do not mix well, several strategies exist to protect mission-critical components from moisture and condensation. One of the most successful methods involves hermetically sealed electronics cavities enabled by moisture-blocking component assemblies such as hermetic feedthrough technology.

A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components

2015-36-055309/22/2015

The increasing use of embedded electronics in aerospace and automotive vehicles increases the designers' concern regarding the reliability of the components as well as the reliability of their interconnections. The discussion about the most appropriate method for assessing the reliability of solder joints for a given application is an ever-present theme in the literature. Several methods of prediction have been developed for assessing the reliability of solder joints. The standard method established by the industries for assessing reliability of solder joints is the thermal cycling. However, when the thermal distributions in real applications are studied, particularly in some electronic components used in on-board electronics of space systems, the thermal cycling does not represent what actually happens in practice in the packaging. The aim of this article is to discuss the methods of thermal cycling; and power cycling for reliability prediction of solder joints of electronic

de Brito, Alirio Cavalcanti, de Oliveira e Souza, Marcelo Lopes

Predicted Device-Degradation Failure-Rate

2015-01-255509/15/2015

There is a concern that the continuing trend on miniaturization (Moore's law) in IC design and fabrication might have a negative impact on the device reliability. To understand and to possibly quantify the physics underlying this concern and phenomenon, it is natural to proceed from the experimental bathtub curve (BTC) - reliability “passport” of the device. This curve reflects the combined effect of two major irreversible governing processes: statistics-related mass-production process that results in a decreasing failure rate with time, and reliability-physics-related degradation (aging) process that leads to an increasing failure rate. It is the latter process that is of major concern of a device designer and manufacturer. The statistical process can be evaluated theoretically, using a rather simple predictive model. Owing to that and assuming that the two processes of interest are statistically independent one can assess the failure rates associated with the aging process from the

Suhir, Ephraim, Bensoussan, Alain, Nicolics, Johann

Stacked Capacitor Special Lead Adapter

TBMG-22186

06/01/2015

The current installation method for tall, stacked capacitors is very cumbersome because the lead form is very sharp and prone to solder cracking due to thermal cycling. An astringent installation process was developed to obtain the best chance of a successful solder joint with a proper heel fillet so the chance of cracking is minimized.