Automotive
Technical Paper

3D- ESPI: Thermal Expansion Analysis of Electronic Components

2006-01-0765

04/03/2006

Event
SAE 2006 World Congress & Exhibition
Authors
H. Schubach Dantec Dynamics GmbH
E. Moser Dantec Dynamics GmbH
Abstract
Content
Meta Tags
Topics
Visibility
Integrated circuits
Soldering
Exterior noise
Affiliated or Co-Author
Dantec Dynamics GmbH
Details
DOI
https://doi.org/10.4271/2006-01-0765
Pages
5
Citation
Schubach, H., and Moser, E., "3D- ESPI: Thermal Expansion Analysis of Electronic Components," SAE Technical Paper 2006-01-0765, 2006, https://doi.org/10.4271/2006-01-0765.
Additional Details
Publisher
SAE International
Published
Apr 3, 2006
Product Code
2006-01-0765
Content Type
Technical Paper
Language
English