Browse Topic: Printed circuit boards

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Powering Up Medtech’s Modalities: Top Trends and Design ConsiderationsTBMG-373508/1/2020
We are living in a digitally integrated and connected world. Evidenced by the use of smartphones, smartwatches, and other smart devices, there is no ending this trend. This holds true across many industries and applications, but is especially prevalent within medtech devices — a market that’s predicted to reach $432.6 billion by 2025.1
Low-Inductance DC Power BusTBMG-361603/1/2020
Anew generation of power electronic conversion systems is being enabled by wide-bandgap (WBG) devices. Applications in civilian and defense sectors are already realizing improved power density and efficiency in power converters that utilize silicon carbide (SiC) and/or gallium nitride (GaN) switches; however, as semiconductor switches become capable of greater hold-off voltage, higher switching frequency, and higher junction temperature, limits on converter performance will depend on the remainder of the system: device packaging, filter components, and thermal management, as examples.
Evaluation of the Effects of Hydrogen Peroxide on Common Aircraft Electrical Materials20AERP02_132/1/2020
Study aims to find a suitable decontaminant/disinfectant/sanitizer that can be used successfully in complex transportation vehicles with no negative impact on sensitive electronic equipment. Federal Aviation Administration, Washington, DC Among all of the large-scale disinfection and/or decontamination technologies available, vaporized hydrogen peroxide (VHP®) is of particular interest due to its rapid sterilization, easy usage, intrinsic environmental friendliness (i.e. simple by-products composed of only water and oxygen), and compatibility with many materials and systems. VHP® technology has been investigated for possible usage in aircraft applications. These studies used vaporized hydrogen peroxide concentrations in the range of 150 - 600 ppm and cycle times of 80 - 120 min. Maximum concentrations of hydrogen peroxide vapor were carefully controlled to avoid condensation in cool locations within the aircraft cabins. Although these studies did not evaluate the compatibility of the various cabin materials with exposure to vaporized hydrogen peroxide, analysis of the collected data showed that VHP® did not seem to have any visible effect on the materials.
Evaluation of the Effects of Hydrogen Peroxide on Common Aircraft Electrical MaterialsTBMG-360582/1/2020
Among all of the large-scale disinfection and/or decontamination technologies available, vaporized hydrogen peroxide (VHP®) is of particular interest due to its rapid sterilization, easy usage, intrinsic environmental friendliness (i.e. simple by-products composed of only water and oxygen), and compatibility with many materials and systems.
Q&A: A Shape-Morphing, Self-Healing Soft CompositeTBMG-357881/1/2020
Carmel Majidi, Professor of Mechanical Engineering at Carnegie Mellon University, and his team has developed a material with a unique combination of high electrical and thermal conductivity, with actuation and self-repair capabilities that are unlike any other soft composite.
Terms, Definitions, and Acronyms Counterfeit Materiel or Electrical, Electronic, and Electromechanical PartsAIR6273 (Current)7/30/2019
The SAE Aerospace Information Report (AIR) provides standardized terms, definitions, and acronyms that may be used in the G-19 and G-21 documents, unless otherwise specified in those documents. The SAE International series of documents that address the mitigation of suspect and counterfeit parts will reference this document in their respective Applicable Documents sections. This AIR is for use by organizations that procure and/or use materiel or EEE parts. The terms and definitions of this AIR are intended to be used in conjunction with other G-19 and G-21 standards.
G-19 Counterfeit Electronic Parts Committee
Hybrid TransformerTBMG-347337/1/2019
Researchers have developed a hybrid transformer that has the benefit of a full planar transformer design but uses a wire-wound secondary winding to keep the parasitic winding capacitances lower. Alone, planar transformers have the advantage of a lower profile and better reproducibility, but wire-wound transformers allow for less parasitic capacitances. By combining elements from traditional wire-wound transformers and planar transformers, the overall performance and reliability were improved.
3D Printable Sensors Disposed of Without Contaminating the EnvironmentTBMG-345926/1/2019
Simon Fraser University and Swiss researchers are developing an eco-friendly, 3D printable solution for producing wireless Internet-of-Things (IoT) sensors that can be used and disposed of without contaminating the environment.
Q&A: Dr. Mahmooda Sultana, Multifunctional Sensor Researcher/Engineer at NASA GoddardTBMG-344055/1/2019
Dr. Sultana won funding to advance a nanomaterial-based detector platform that can sense environmental parameters from minute concentrations of target gases and vapors, to atmospheric pressure and temperature, and then transmit that data via a wireless antenna — all from the same 3 × 5’’ self-contained platform.
Securing Printed Board Performance and Assembly Reliability in Automotive Applications through IPC Standards2019-01-12534/2/2019
Industry consensus developed IPC standards for the automotive electronics manufacturer have been available since 2016. We will look at the current IPC standards available in development and in revision, the standards development process, and the automotive application addendums for printed board fabrication and assembly soldering that provide unique criteria for the reliability of electronic interconnects that must survive the harsh environments within the automotive industry. Attention will be given to a new effort in development to provide links between existing automotive-centric IPC standards and other industry standards applicable to automotive applications for printed board material selection, design, and solder joint reliability testing. We will also discuss challenges facing the industry, including process changes and cleanliness requirements, e.g. ionic contaminants, that affect every manufacturer and customer.
Perry, John, Rowe, Teresa
How FMC Developments Support Legacy and Next-Gen Data Needs19AERP04_044/1/2019
While FMC (FPGA Mezzanine Card) celebrated its 10th anniversary this year, it continues to provide a variety of benefits to the embedded system developer. These include sustained implementation and deployment in new technologies. Additionally, the release of FMC+ provides improved design capabilities. However, with data rates always on the rise and shrinking form factors, the question arises: Why does FMC continue to be so popular and what has sustained it over the years? With its ability to de-risk designs while cutting costs, Field Programmable Gate Array (FPGA) technology has allowed for more efficient design within the embedded marketspace. Often acting as an all-in-one solution, FPGAs negate the need for ASIC technology and reduce the cost of custom IP algorithms in silicon. Even during post-processing, FPGAs allow engineers to modify their logic after silicon is on the board. The results allow for more efficient prototyping and a faster time to market.
How FMC Developments Support Legacy and Next-Gen Data NeedsTBMG-341214/1/2019
While FMC (FPGA Mezzanine Card) celebrated its 10th anniversary this year, it continues to provide a variety of benefits to the embedded system developer. These include sustained implementation and deployment in new technologies. Additionally, the release of FMC+ provides improved design capabilities. However, with data rates always on the rise and shrinking form factors, the question arises: Why does FMC continue to be so popular and what has sustained it over the years?
Create the Future Design Contest Alumni Achieve Market SuccessTBMG-339343/1/2019
The Create the Future Design Contest, launched in 2002 by the publishers of Tech Briefs magazine, helps stimulate and reward engineering innovation. The annual event has attracted more than 15,000 product design ideas from engineers, entrepreneurs, and students worldwide.
Using Inkjet Printers to Build a New Biosensor for Less Invasive Breast Cancer DetectionTBMG-338823/1/2019
Researchers at the National Institute of Biomedical Imaging and Bioengineering (NBIB) have created a novel, low-cost biosensor to detect Human Epidermal Growth Factor Receptor 2 (HER-2), a breast cancer biomarker in the blood, allowing for a far less invasive diagnostic test than the current practice, a needle biopsy. The scientists combined microfluidic technology with diagnostics, including electrochemical sensors and biomarkers, into a powerful package that can give results in about 15 minutes.
Process for Assessment and Mitigation of Early Wearout of Life-Limited MicrocircuitsARP6338A (Current)2/8/2019
This document is intended for use by designers, reliability engineers, and others associated with the design, production, and support of electronic sub-assemblies, assemblies, and equipment used in AADHP applications to conduct lifetime assessments of microcircuits with the potential for early wearout; and to implement mitigations when required; and by the users of the AADHP equipment to assess those designs and mitigations. This document focuses on the LLM wearout assessment process. It acknowledges that the AADHP system design process also includes related risk mitigation and management; however, this document includes only high-level reference and discussion of those topics, in order to show their relationship to the LLM assessment process.
APMC Avionics Process Management
Medical Device Design: The Importance of Thoughtful Adhesive SelectionTBMG-337322/1/2019
Selecting an adhesive when designing a wearable medical device is not a trivial exercise. Too often the adhesive selection process is executed with the mindset “tape is tape” — a major oversimplification; or, it's assumed that the strongest adhesive for every application is the best choice.
Miniaturizing Smart Wearables for Fitness and Activity TrackingTBMG-337292/1/2019
Traditionally, small chip antennas used in Bluetooth-enabled devices have required a designated ground “keep out” area to minimize interference from other components and ensure the ideal radiation pattern for wireless signals. In some cases, this reserved space can eat up as much as 15 × 20 mm of the printed circuit board (PCB).
Inkjet-Printed Biosensor Offers Less-Invasive Breast Cancer DetectionTBMG-337192/1/2019
Researchers have created a novel, low-cost biosensor to detect HER-2, a breast cancer biomarker in the blood, allowing for a far less-invasive diagnostic test than the current practice, a needle biopsy. Scientists combined microfluidic technology with diagnostics, including electrochemical sensors and biomarkers, into a powerful package that can give results in about 15 minutes.
Using LCP-Based Flexible Substrates for Medical Smart Sensor ApplicationsTBMG-328109/1/2018
Medical devices require sensors that are miniaturized, highly reliable and integrated, cost-effective, hermetic, and biocompatible. By combining thin film technology with traditional flex circuit manufacturing technologies, substrates with enhanced properties can be manufactured and assembled using standard surface-mount technology (SMT) processes.
Flexible, Compliant, Multiline Microprobes for Measuring Material Electrical PropertiesTBMG-328599/1/2018
The ability to measure the electronic conductivity of battery film coatings is a pressing need in the battery industry; however, these measurements can be difficult, and prior methods have not been sufficiently accurate and robust. New surface probes were developed that can accurately measure electronic conductivity of battery film coatings.
Microcontroller Altimeter (uCA)TBMG-324868/1/2018
Traditional altitude switch designs for harsh environments are mechanical in nature and operate by means of an inflatable bladder or bellows that mechanically depresses a pushbutton switch. The altitude trip point is set by mechanically adjusting the distance of the switch to the bellows. The mechanical action of the switch results in a loss of accuracy on the order of several thousand feet, forcing engineers to design interfacing systems with an extremely high error tolerance. Furthermore, these types of systems are typically large and unreliable, difficult to manufacture, and prone to failure under certain operating conditions.
Machine Vision Can Do More Than You ThinkTBMG-324678/1/2018
The ability to automatically extract information from digital images opens many doors for manufacturers striving to cut costs, improve quality, and streamline their processes overall. The primary uses of machine vision are inspection, gauging, and robot guidance. These tasks require repetitive activities to be performed as quickly as possible and with a high degree of accuracy, which is precisely where machine vision systems excel. They have also become increasingly cost-effective and simpler to implement over the last couple of decades.
Microservices Drive Digital and Connected Health Efficiencies and GrowthTBMG-324618/1/2018
Healthcare is poised for significant change over the coming years as a result of emerging technologies like artificial intelligence (AI), virtual assistants, sensors, and wearables. Significant investments have been made in transitioning providers to EMR systems, but the benefits of this digital transformation has not yet been fully realized. Microservices are a new software development technique that provides a number of advantages in architecting back-end solutions while offering particular benefits in developing digital and connected healthcare solutions.
Q&A: Dr. Yanfei Xu, Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MATBMG-296977/1/2018
Plastics are excellent thermal insulators — a quality that can be an advantage in some applications. But this property is less desirable in products such as plastic casings for laptops and mobile phones, which can overheat. Dr. Xu is a member of a team that has developed a new polymer that works as a heat conductor. The polymer, which is lightweight and flexible, can conduct ten times as much heat as most commercial polymers.
Evaluating Electronics Contract Manufacturers for Medical DevicesTBMG-291006/1/2018
The ideal contract manufacturer is more than a transactional supplier; rather, it is a partner that improves the product and process. Printed circuit boards (PCBs) and electronic box build assemblies are critically important in the medical field. Today, most medical devices used in healthcare settings to diagnose, test, or treat patients, as well as devices critical to laboratory research, rely on PCBs in one way or another.
Using Digital Microscopes as Inspection ToolsTBMG-288825/1/2018
Digital microscopes are being automated and computerized to make them easier to use, display more data with more detail and precision, and expand their areas of application. With traditional microscopes, you need years of experience in order to take full advantage of the instrument. Digital microscopes can reduce the learning period by automatically selecting many of the settings to optimize an image. They can focus, zoom, polarize light, move filters in and out, and utilize tools like differential interference contrast (DIC) prisms.
Preliminary Study of LIDAR Scanner-Based Collision Avoidance in Automated Guided Systems for Autonomous Power Equipment Products2018-01-00324/3/2018
Technology is continuously being developed to prevent self-driving vehicles from crashing. That technology could also be considered for other autonomous products. Collision avoidance in automated guided systems using a light detection and ranging (LIDAR) scanner has been studied for application in low-speed autonomous Honda Power Equipment products, such as self-driving lawn mowers. The automotive application of a LIDAR scanner for autonomous driving is used for obstacle detection and offline local area. Such delineations do not exist in areas where power equipment is used, such as grass fields; therefore, identifying object height and distance is a relatively new area. For this study, a small LIDAR scanner with a resolution of 0.01 m and a measurement range of 0.05 to 40.00 m was used on a Honda self-driving lawn mower. The measurement distance data was directly processed in the scanner, enabling the drive unit to obtain distance information during actual operation. Based on real-time data, collision avoidance and automated operation guidance could be achieved. Simplified object detection and an automated guided decision-making system were developed. System parameters were considered to optimize collision avoidance and the structure of the automated guided system. Field testing was performed at a dedicated test field facility, and the test condition was determined. Fences, tall grass, and ground levels were successfully classified during testing operation. Collision avoidance, running, and stop modes were identified by onboard LIDAR scan data. Based on the field test analysis, a developed autonomous system structure is suitable for lawn, snow, and future power equipment applications.
Hasegawa, Toshiyuki, Wians, Jeff
Nett WarriorTBMG-287914/1/2018
Nett Warrior is the US Army's next generation US integrated soldier system that replaces Land Warrior. It is designed to be an integrated dismounted situational awareness and mission command system for use during combat operations that enables fast and accurate decision-making during tactical operations.
Industrial Rotary Encoders: Selecting the Right Device for Your ApplicationTBMG-288114/1/2018
Rotary encoders play important roles in motion control and industrial automation systems, providing control systems with information about the motion of motor shafts, pulleys, robot arms, etc. There are many variants available — some familiar and some highly innovative.
Mixing 3D Printing Technologies Helps Optimize ProductsTBMG-285703/1/2018
Stratasys Eden Prairie, MN
NASA CubeSats: Pushing the Boundaries of Technology18AERP02_062/1/2018
NASA's Small Spacecraft Technology Program is on the countdown clock to advance communications and proximity maneuvering capabilities for CubeSats with the Integrated Solar Array and Reflectarray Antenna (ISARA) mission. The spacecraft is a 3U CubeSat carrying a Ka-band payload that includes a low-power transmitter, High Gain Antenna (HGA), standard gain reference antenna, and RF antenna select switch. A Ka-band ground station will verify high data rate by signal-to-noise (SNR) measurement, and measure the antenna performance. The HGA gain will be measured by switching between the HGA and an onboard standard gain antenna (SGA), while the spacecraft will be slewed on orbit to measure the antenna patterns. The on-orbit data will be compared to measurements that were taken prior to launch.
Additive Manufacturing Materials for RF ComponentsTBMG-283882/1/2018
The Army Aviation and Missile Research, Development, and Engineering Center (AMRDEC) Weapons Development and Integration (WDI) Directorate has a program known as PRIntable Materials with Embedded Electronics (PRIME2). PRIME2 will integrate RF and electronics into additive manufacturing processes to reduce size, weight, and overall cost of these components and subsystems. This program will advance the state of the art in printable electronics, and deliver a materials database, process development, modeling, and simulation of 3D-printed objects with embedded conductive elements, passive prototypes, and RF prototypes. PRIME2 will create a new fabrication capability (applied to electronics and RF technology areas), weight reduction, higher reliability, and on-demand (local and immediate) spare components in the field.
NASA CubeSats: Pushing the Boundaries of TechnologyTBMG-283912/1/2018
NASA’s Small Spacecraft Technology Program is on the countdown clock to advance communications and proximity maneuvering capabilities for CubeSats with the Integrated Solar Array and Reflectarray Antenna (ISARA) mission.
Laser Direct Structuring for Sensor ManufacturingTBMG-283622/1/2018
Every day the world’s leading medical device companies rely upon laser direct structuring (LDS) to meet their most demanding design and performance requirements. Millions of electronic components with complex geometries are cost-effectively manufactured each year through the use of LDS to create circuit traces on three-dimensional molded interconnect devices (3D-MID).
Infrared TestingJ359_201801 (Current)1/9/2018
The scope of this SAE Information Report is to provide general information relative to the nature and use of infrared techniques for nondestructive testing. The document is not intended to provide detailed technical information, but will serve as an introduction to the theory and capabilities of infrared testing and as a guide to more extensive references.
Metals Technical Committee
Scaling LiDAR Optical Payloads from Drones to Miniature UAVs17AERP10_0310/1/2017
The recent surge in demand for adaptive cruise control (ACC) and commercial autonomous vehicles has drawn a lot of attention to these innovative applications. Based on pulsed laser diodes and hybrid receivers with Avalanche Photodiodes (APDs) for laser range finding (LRF), these systems are often classified under the general acronym LiDAR (Light Detection and Ranging). LiDAR systems focus light beams on targets to allow measurement of distance by detecting the faint signals echoed back to the launch point and timing the difference between the launch and detection timestamps. This method is similar to focused sound waves used in sonar applications or radio waves used in radar applications. It is used in a broad range of end applications, from adding topography through three-dimensional mapping of still images, to general surveying of urban settings, telemetry for final docking stages of capsules after reaching the International Space Station (ISS), and mapping density of the forest canopy from the same outer-space vantage point.
Feed Mechanism and Method for Feeding Minute ComponentsTBMG-2769510/1/2017
Electrical circuits such as printed wiring boards or hybrid microcircuits designed to utilize surface mount electrical components are commonly assembled by computer-controlled automated equipment. These machines typically use a vacuum nozzle to pick up and handle the components during assembly. Three methods are commonly used to feed surface mount components to automatic assembly equipment: tape reel feeders, linear or bowl-type vibratory feeders, or waffle-style packages.
PC-Board-Mountable Corrosion SensorsTBMG-2766410/1/2017
Corrosion is a pervasive and expensive problem in applications ranging from construction to microelectronics. Corrosion has been widely studied in theories, and empirical studies exist for common materials, material combinations, and myriad environmental conditions. In order for microelectronic devices to perform and function properly, high-reliability packaging is important. Failure of microelectronic devices and packages not only causes a malfunction of the devices themselves, but can lead to catastrophic events for entire systems, which may cause loss of life, property, and safety.
Scaling LiDAR Optical Payloads from Drones to Miniature UAVsTBMG-2764910/1/2017
The recent surge in demand for adaptive cruise control (ACC) and commercial autonomous vehicles has drawn a lot of attention to these innovative applications. Based on pulsed laser diodes and hybrid receivers with Avalanche Photodiodes (APDs) for laser range finding (LRF), these systems are often classified under the general acronym LiDAR (Light Detection and Ranging).
LED Light Sources Tests and Requirements StandardJ2938_201709 (Current)9/15/2017
This SAE Recommended Practice provides the methods of measurements for electrical and photometric characteristics of LED packages. It provides procedures, requirements, and guidelines for the methods of the measurement of luminous flux and color maintenance of LED devices (packages, arrays, and modules) for ground vehicle lighting applications.
Lighting Standard Practices Committee
Eliminating Electrical Arcing in Satellite Systems17AERP09_059/1/2017
In 1995, Boeing Satellite Systems introduced a new family of communication satellite buses, with bodies that contain power, control, and propulsion systems. They used a high-voltage bus connected to a 100V stabilized power source, instead of the standard 27V. This introduced an increase in operating voltage that decreased operating currents and lowered the corresponding ohmic losses in the conductors. However, it also introduced a potentially catastrophic failure to the satellites' electronic systems: electrical arcing (Figure 1). Vasily Kozhevnikov, researcher at the Institute of High Current Electronics in Tomsk, Russia, explains: “The transition to the new standard of operating voltages has led to the problem of an electric arc ignition between the elements of the electronic circuit boards. In order to keep the mass of the satellite as small as possible, the space inside the circuit housing is not filled with an insulator or built to hold a vacuum. But that allows electric arc discharge or discharge cascade that can potentially spread over a large volume of onboard equipment.
Eliminating Electrical Arcing in Satellite SystemsTBMG-274949/1/2017
In 1995, Boeing Satellite Systems introduced a new family of communication satellite buses, with bodies that contain power, control, and propulsion systems. They used a high-voltage bus connected to a 100V stabilized power source, instead of the standard 27V. This introduced an increase in operating voltage that decreased operating currents and lowered the corresponding ohmic losses in the conductors. However, it also introduced a potentially catastrophic failure to the satellites’ electronic systems: electrical arcing (Figure 1).
Drug-Delivery Systems: Building in ReliabilityTBMG-272517/1/2017
Systems that deliver medication — whether implanted or at the patient bedside in the hospital — are often vital for the survival of patients. Drug-delivery devices include ambulatory infusion pumps, patch pumps for insulin delivery, linear peristaltic pumps, rotary peristaltic pumps, and tiny implantable pumps for those with chronic pain. These systems require absolute reliability, which ultimately minimizes risk and lowers costs for both hospitals and users. Designing this high level of reliability into these systems requires the latest advances in motor technology.
Origami-Inspired Robot Fits in Tight SpacesTBMG-270696/1/2017
Researchers at NASA's Jet Propulsion Laboratory (JPL) were inspired by origami when they developed the Pop-Up Flat Folding Explorer Robot (PUFFER). Its lightweight design — which can hitch a ride aboard a rover — can flatten itself, tucking in its wheels and crawling into places that larger robots can't fit. Over the past year and a half, PUFFER has been tested in a range of rugged terrains, from the Mojave Desert in California to the snowy hills of Antarctica. The idea is to explore areas that might be too risky for a full-fledged rover to go, such as steep slopes or behind sand dunes.
Sensors’ Role Evolves as New Wearables EmergeTBMG-270216/1/2017
Microelectromechanical system (MEMS)-based components, such as sensors and actuators, began penetrating the wearable products market about a decade ago, when the first accelerometers replaced mechanical springs in pedometers and step counters.
Bringing New Vision to Laser Material Processing SystemsTBMG-268995/1/2017
The use of modern laser technology has become standard in industrial manufacturing thanks to its speed, accuracy and effectiveness. Lasers are used to engrave parts, electronic printed circuit boards or chip cards. They perforate packaging; structure semiconductor wafers; drill, cut and weld plastics or metals; and create highly complex structures via 3D printing.
Autonomous Vehicles Open Up New Roads for LIDAR GrowthTBMG-269035/1/2017
Laser range-finding, or LIDAR, is a way of measuring distance, directly analogous to radar except using radiation in the near infrared range of the electromagnetic spectrum rather than the radio waves used in radar. LIDAR techniques are used for a variety of final applications including terrain-mapping for geology, urban planning and archaeology; distance measurement for surveying, golf, hunting, military applications, and docking of large ships; and speed measurement for traffic monitoring and speed limit enforcement.
Solder Void Modeling and Its Influence on Thermal Characteristics of MOSFETs in Automotive Electronics Module *CSP Meta QA Testing*2017-01-00113/28/2017
Current generation automobiles are controlled by electronic modules for performing various functions. These electronic modules have numerous semiconductor devices mounted on printed circuit boards. Solders are generally used as thermal interface material between surface mount devices and printed circuit boards (PCB) for efficient heat transfer. In the manufacturing stage, voids are formed in solders during reflow process due to outgassing phenomenon. The presence of these voids in solder for power packages with exposed pads impedes heat flow and can increase the device temperature. Therefore it is imperative to understand the effect of solder voids on thermal characteristics of semiconductor devices. But the solder void pattern will vary drastically during mass manufacturing. Replicating the exact solder void pattern and doing detail simulation to predict the device temperature for each manufactured module is not practical. Hence different numerical models are studied for the solder, by using single and distributed void patterns matching the percentage void fraction. The numerical studies indicated that distributed void pattern captures the void behavior well compared to single void model. For the MOSFET (Metal-Oxide-Semiconductor-Field-Effect-Transistor) device under study, it is observed that the void percentage up to 20% has negligible impact on device temperature for its maximum rated power. The temperature rise because of increase in void percentage (from 20% to 50%) for different power ratings of MOSFET is discussed in the paper. A risk rating chart is also provided as guideline for solder void rejection.
Sridharan, Kesav Kumar, Viswanathan, Swaminathan
SOLVING THE INTERCONNECT CHALLENGE: How to Bring Flexibility to Wearable DesignTBMG-264933/1/2017
Micro-Electro-Mechanical Systems (MEMS) are more prevalent than ever, especially in the popular configurations known today as “wearables.” Leading MEMS and sensors in the multitude of wearable technologies include accelerometers, gyros, magnetometers, microphones, UV sensors, glucose monitors, barometers, humidity detectors, and heart rate instruments.
Computer Chips Calculate and Store in an Integrated UnitTBMG-265183/1/2017
Researchers at the University of Wisconsin-Madison created computer chips that can be configured to perform complex calculations and store massive amounts of information within the same integrated unit, and communicate efficiently with other chips. Called “liquid silicon” — liquid for software and silicon for hardware — the technology has uses in data-intensive applications such as facial or voice recognition, natural language processing, and graph analytics.
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