Browse Topic: Printed circuit board assemblies

Items (16)
Find
MES as a Single Source of Truth: Achieving Regulatory Compliance at SpartonTBMG-2648703/01/2017
A couple of years ago, contract manufacturer Sparton Corporation faced increasing demand for high-quality, highly complex products that were delivered as quickly as possible. The multisite contract manufacturer serves highly regulated end markets, including the medical device industry. With customer needs that range from advanced robotics and lasers to sophisticated medical devices, product quality is of utmost importance to meet complex regulatory requirements. To meet its increasing demand effectively while also meeting compliance and traceability requirements, the company found itself monitoring numerous data sets across multiple facilities.
Magazine Article
Technical Guidelines for Aerospace and High Performance Electronic Systems Containing Lead-free Solder and FinishesGEIAHB0005_2 (Current)06/17/2016
This document is intended for use as technical guidance by Aerospace system suppliers, e.g., Aerospace system Original Equipment Manufacturers (OEMs) and Aerospace system maintenance facilities, in developing and implementing designs and processes to assure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as AHP) both during and after the transition to Pb-Free electronics. This document is intended for application to aerospace products; however, it may also be applied, at the discretion of the user, to other products with similar characteristics, e.g., low-volume, rugged use environments, high reliability, long lifetime, and reparability. If other industries wish to use this document, they may substitute the name of their industry for the word “Aerospace” in this document. The guidelines may be used by the OEMs and maintenance
G-24 Pb-free Risk Management Committee for ADHP
Information Report
Maximizing Thermal Cooling Efficiencies in High-Performance ProcessorsTBMG-2229206/01/2015
Despite the continuous development of new, higher performing processors, the thirst for increased embedded computing capability remains unquenched. In fact, it seems like Moore’s Law may have slowed when it comes to frequency but increased in terms of driving processor core and field programmable gate array (FPGA) LUTS counts. The previous need for fewer frequency increases has become a need for increased core counts, faster front side bus speeds, and greater support chip integration, all of which drive continually rising power requirements. Meeting these ever increasing "compute density escalations" while simultaneously maximizing thermal cooling efficiencies requires innovative packaging solutions.
Magazine Article
Dynamic Response Determination of Electronic Printed Circuit Board (PCB)2013-01-279911/27/2013
The automotive electronic systems are composed of two major mechanical elements: an equipment housing or enclosure, and a printed circuit board (PCB) assembly. The PCB is made up of alternating layers of copper and FR-4 glass epoxy laminated together. An estimation of the mechanical reliability of a PCB in an electronic system is considered to be an important part of the overall reliability estimate of the entire system and vibration is often one of the key causes of system and component failures. As different kind of electronic components (like transformers, capacitors, chips etc) are mounted on both sides of the PCB using solder joints, adhesive etc, various complexities are encountered while modeling them for analysis. For avoiding those, simple PCBs without any components are considered for the present study. This paper focuses on the methodology to understand and predict the dynamic behavior of the system using various mechanical tests and simulations. The material properties
Jagdale, Rahul, bardia, Prashant, Schmaltz, Mark
Technical Paper
Performance Standard for Aerospace and High Performance Electronic Systems Containing Lead-free SolderGEIASTD0005_1A (Historical)03/01/2012
This standard defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems containing Pb-free solder, piece parts, and PBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. It is intended to communicate requirements for a Pb-free Control Plan (LFCP), hereinafter referred to as the Plan, and to assist the Plan Owners in the development of their own Plans. The Plan documents the Plan Owner’s processes that assure their customers, and all other stakeholders that the Plan Owner’s products will continue to meet their requirements, given the risks stated in the Introduction. This standard does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that must be addressed by the processes. Pb
G-24 Pb-free Risk Management Committee for ADHP
Information Report
Virtual Design of Automotive Electronics Towards Vibration Reduction2011-28-008010/06/2011
Most modern automotive electronic systems are composed of two major mechanical elements: an equipment chassis or enclosure, and a PCB (Printed Circuit Board) assembly. The PCB is composed of laminated copper and FR-4 glass epoxy. Very small and delicate electronic components are populated on both sides of it. As the amount of electronics on vehicles increases, the electronic control units (ECU) are becoming larger, increasing the size and mass of the board as well. The vibration often plays the key cause of invalidation and component failures. In the design of PCB assemblies, it is preferable to increase their fundamental natural frequency for improving the fatigue life because the PCB displacements are reduced very quickly. PCBs carrying electronic components are typically fastened with screws to the enclosure. The locations of the supporting screws and the large component placements can be optimized to achieve a maximum fundamental natural frequency for the loaded PCB. With this
Bardia, Prashant
Technical Paper
Collaborative Electronics Supply Chain Models2004-21-005010/18/2004
The EMS (Electronics Manufacturing Services) industry has evolved in the “high-tech” electronics market as a reliable business partner to OEMs both in collaborative new product design, and in creation and management of supply chains for electronic products. Can the automotive industry adopt a similar model? The automotive industry faces many challenges as electronics content continues to grow to a larger portion of the cost of new vehicles. While fostering innovation and new technology development that can enable consumer differentiation, new products must be carefully validated to ensure they function in harmony with all vehicle systems. The industry also needs to design supply chains to meet both the high reliability and the aggressive cost reduction goals demanded by the industry. Through examples we will demonstrate how a collaborative electronics supply chain is efficiently deployed in various market sectors.
Heinzen, Steve, Thiel, Mike, Rao, Srinivas
Technical Paper
Failure Mechanisms of Ball Grid Array Packages Under Vibration and Thermal Loading2004-01-168603/08/2004
Automotive electronics face increasing reliability challenges in meeting thermal and vibration requirements. This paper addresses these challenging issues through an overview of automotive application environments; their corresponding accelerated life tests, and physics of failures. The accelerated load level is determined by industry-accepted formulations. Basis of accelerated life testing for both thermal and vibration is discussed. Dynamic difference in loading frequency and magnitude leads to different failure mechanisms. Under thermal and vibration loading conditions, fatigue domains and commonly observed failure modes of electronic components are further characterized in terms of low cycle and high cycle fatigue. Material behaviors under these loading conditions are also discussed with experimental and analytical results. In particular, failure mechanisms of ball grid array (BGA) packages are presented for thermal and vibration loading conditions. Observed failure mechanisms of
Li, Ron S.
Technical Paper
An Expandable Passive Optical Star Network Architecture for Automotive Applications1999-01-030303/01/1999
When comparing vehicle communication architectures, the passive star network has been shown to be the highest fault tolerant system. Despite this trait, the passive star architecture has not been widely implemented due to its potential application limitations: insufficient node count and relatively short node lengths. These constraints arise from the basic function of the star, i.e. to evenly distribute a given amount of optical power to all nodes connected to the star without amplification or retransmission. This paper provides a solution to overcome the limitations of the passive star through the introduction of a new communication component, the Active Distribution Node (ADN). The ADN enables a passive star network to support larger node counts and significantly longer node lengths, without sacrificing fault tolerance or the low cost nature of the basic passive star architecture.
Lynn, Mark, Montgomery, Scott, Moy, Kin
Technical Paper
Truck Electronic Packaging95262811/01/1995
Electronic controls continue to propagate on vehicles in the truck industry. Many people, including engineering design personnel, do not fully understand the design, development, test, and manufacturing process for electronics. This paper specifically reviews design and test techniques necessary to produce a reliable electronic package. Potential benefits of a superior mechanical package include ease of installation and service, simple manufacturing process techniques, and protection from surrounding environmental conditions.
Weyer, Rob
Technical Paper
Achieving Quality Through Flexible Inspection91164208/01/1991
Machine vision has historically been used as a quality audit tool in the automotive industry. New generation vision hardware offers the potential for integrating machine vision into the manufacturing process as an interactive process control tool. This paper is a case study in the application of machine vision integrated into a production line to feed process control data to a system controller in addition to performing statistical process control functions on a real time basis. The paper describes the initial application of the concept referred to as Flexible Inspection, [5]*, [11], and an example inspection algorithm for determining the presence/absence of components on a printed circuit board. The production activity chosen for the study is a printed circuit assembly line in an automotive electronics assembly plant. The potential impact of this type of system on automotive manufacturing is assessed through empirical data. Flexible inspection will reduce process variability while
Johnson, Carroll, Foster, Joseph W.
Technical Paper
The Electronic Environment for Off-Highway Equipment89189009/01/1989
Benefits of adapting electronic controls to off-highway equipment are improved performance and productivity. Such improvements may be realized in several ways; for example, reduced fuel consumption, less time required to complete a task, more accurate results in work performed, and reduced operator fatigue by automating functions. It is obvious that the controller must be reliable, and that the reliability of the system is dependent upon the ability of critical components to operate as intended under environmental stresses normally present in the application. Off-highway equipment can be subjected to harsh environmental stresses produced by various climatic, mechanical and electrical conditions. An understanding of these conditions, the detrimental effects they may produce, and protection against such effects are important considerations for the design of reliable electronic control systems.
Ross, L. F.
Technical Paper
Semi-Custom Integrated Circuits Simplify Electronic Speech Synthesis Modules in Automobiles85002702/01/1985
The availability of low cost integrated circuits as general purpose speech synthesisers has enabled automotive manufacturers to add speech synthesis as a major feature in automobiles. While general purpose speech synthesizers cannot always meet the requirements of automotive applications, due to their space and cost constraints, the use of application specific or custom integrated circuits can meet these considerations. Gould AMI's S3620 speech synthesiser has been designed as a macro cell that can be easily modified to form custom speech synthesis circuits at much less the development cost and time required for full custom circuits.
Kung, Alice H.
Technical Paper
Corrosion Failures in Semiconductor Devices and Electronic Systems83183012/05/1983
The automotive environment with its wide range of temperatures and corrosive liquids and gases provides a harsh environment for electronic systems. This situation is further compounded by the fact that these systems are composed of a wide variety of dissimilar materials. It should be no surprise, therefore, that corrosion can be a significant problem in electronic systems. This paper will discuss corrosion problems related to the following: open circuits in connector contacts, leakage and shorts on printed circuit boards, metal migration problems, and corrosion problems in plastic encapsulated semiconductor devices. In many of these corrosion situations, the initial mechanism involved in the corrosion process will often cause an electronic system to malfunction. It is, therefore, of utmost importance that these corrosion mechanisms be carefully evaluated during the development of electronic systems so that necessary steps can be taken to prevent their occurrence.
Cook, J.P., Servais, G.E.
Technical Paper
Reliability Considerations in the Manufacture of Chrysler's Electronic Instrument Cluster81017702/01/1981
Chrysler Corporation's Huntsville Electronics Division recently completed the production launch of the MY 81 Imperial Electronic Instrument Cluster. A review is made herein, from a manufacturer's viewpoint, of the events and considerations that were instrumental in maintaining or enhancing the Electronic Instrument Cluster reliability.
Heinrich, Bernard F.
Technical Paper
A Microcomputer-Based Automotive Comfort Control System80047602/01/1980
A microcomputer has been added to the Panel Control portion of an automotive heating and air conditioning control system. All Panel Control tasks are done by the microcomputer including multiplexing of LED displays, interpretation of the keyboard, reception of information from the engine control system and command of the Programer portion of the system. The flexibility of the microcomputer has proven useful in meeting changing customer requirements. This paper describes the application of the microcomputer to this new automotive product.
learner, Karl O.
Technical Paper
Items per page:
1 – 16 of 16