Technical Paper

HIGH POWER SURFACE MOUNT PACKAGES

980349

2/23/1998

Event
International Congress & Exposition
Authors
Michael Hundt ST Microelectronics, Inc.
Abstract
Content
No Abstract available
Meta Tags
Topics
X-by-wire
Transportation Systems
Design Engineering and Styling
Steel
Electric vehicles
Fuel economy
Electronic equipment
Semiconductors
Affiliated or Co-Author
ST Microelectronics, Inc.
Details
Citation
Hundt, M., "HIGH POWER SURFACE MOUNT PACKAGES," International Congress & Exposition, Detroit, Michigan, United States, February 23, 1998, .
Additional Details
Publisher
SAE International
Published
2/23/1998
Product Code
980349
Content Type
Technical Paper
Language
English