Using Polyimide In 3D Thin Film Multilayer Circuitry

Today, the cost and complexity of all platforms and systems in military and defense technologies are being challenged by the need for high functionality in smaller but less expensive architecture, especially in light of current national budget challenges. In the area of RF and microwave electronics it is becoming evident that a move from two dimensional (2D) planar circuitry architecture to three dimensional (3D) thin film multilayer technology can result in dramatic reduction of chip size, increase of operation speed, and lower total module costs.