Magazine Article

Software-Connected Wafer Level Reliability Test

TBMG-38353

01/01/2021

Abstract
Content

A key measure driving performance in semiconductor integrated circuits (ICs) is reliability. As ICs continue to become smaller and chip complexity increases, manufacturers need to ensure they can continue to provide the same level of reliability to their customers for mission-critical end applications.

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Citation
"Software-Connected Wafer Level Reliability Test," Mobility Engineering, January 1, 2021.
Additional Details
Publisher
Published
Jan 1, 2021
Product Code
TBMG-38353
Content Type
Magazine Article
Language
English