Software-Connected Wafer Level Reliability Test
TBMG-38353
01/01/2021
- Content
A key measure driving performance in semiconductor integrated circuits (ICs) is reliability. As ICs continue to become smaller and chip complexity increases, manufacturers need to ensure they can continue to provide the same level of reliability to their customers for mission-critical end applications.
- Citation
- "Software-Connected Wafer Level Reliability Test," Mobility Engineering, January 1, 2021.