Dispensable Gels VS Gap Filler Pads

An Analysis of Thermal Management Materials

As advances in electronic products have required higher power in smaller packages, the challenges associated with thermal management have become more intense. Two general types of thermal interface materials - gels (or dispensable gap fillers) and gap filler pads - are commonly used by design engineers for displacing air voids and ensuring proper heat transfer. Each has distinct advantages depending on the application.

Following is an analysis of key performance and manufacturability characteristics in both conventional gap pads and new advances in dispensable gel materials.