Advanced Thermal Management Solutions

Now more than ever, devices with increasing power and smaller footprints are demanding a good stable costeffective thermal management solution. Fortunately many options are available today. However, for device packaging designers not familiar with these technologies, determining which thermal management technology is appropriate for their application can be a challenging task. To help sort out the many options, here is an overview of three very different thermal technologies: passive heat pipes, pumped two-phase cooling systems and temporary thermal storage/ phase change materials (PCM) heat sinks. In each case we’ll provide an overview of each of these technologies, explain how they function and provide some examples of when they should be considered.